خط تولید

Factory Introduction

Shenzhen Hugsun Technology Co., Ltd. was founded in 2013, with a total investment of RMB 55 million. Covering a plant area of 5,000 ㎡, we employ nearly 200 staff including more than 30 senior technical engineers. 
Our site hosts independent workshops for SMT, DIP insertion, testing and assembly. We deliver professional OEM PCB assembly services targeting automotive, industrial control, Bluetooth‑enabled and financial electronics, covering full‑range services including SMT placement, post‑soldering, functional testing and product assembly.


Production Capacity

We operate 12 SMT production lines, delivering a daily placement capacity of 30 million components.
  • PCB dimension: Min 50×30 mm; Max L510×W460 mm
  • PCB thickness range: 0.3 mm‑4.5 mm
  • Placement accuracy: ±0.02 mm
  • Component range: from 01005 up to 32 mm square components; maximum component size 45×100 mm
Our DIP workshop runs 2 insertion lines with a daily capacity of 250,000 insertion points.

We have 5 dedicated test lines supporting 500,000 pieces tested per day, plus 2 assembly lines with daily finished‑product output of 2,000 PCS.
We are well‑equipped with high‑end manufacturing and inspection facilities, including Panasonic & Yamaha high‑speed mounters, nitrogen reflow ovens, wave soldering machines, 3D‑SPI, 2D/3D‑AOI systems, X‑ray counters, laser marking & depaneling machines, conformal coating equipment and complete sets of test instruments for Bluetooth, cellular‑network and electrical‑performance verification.


Quality Control & Certifications

Quality is embedded in our whole manufacturing workflow. We hold ISO9001, ISO13485 and IATF16949 certifications, supporting strict quality requirements for automotive, medical and industrial electronics.
Our in‑house quality lab implements comprehensive inspection and validation:
  • In‑process testing: MES system management, first‑article inspection, SPI solder‑paste inspection, AOI optical inspection, X‑ray internal inspection, solder‑paste lifecycle control, insertion‑station inspection and BGA rework.
  • Environmental reliability validation: RoHS compliance test, high‑low temperature cycling, drop test, vibration test and salt‑spray test.


Standard Control Workflow

We follow a standardized full‑process manufacturing flow for each order:


Customer incoming material → MES order creation → IQC incoming quality check → Pre‑production review → Solder‑paste printing → Solder‑paste inspection → Component placement → First‑article validation → Pre‑reflow AOI → Reflow soldering → Reflow‑side AOI → Profile temperature monitoring → DIP through‑hole insertion → Testing & assembly → FQC final quality check → Packaging & warehousing → QA release & shipment.
Material traceability is enabled by the MES system across all production phases to track every batch of components and finished goods.


Quality Objectives

Strictly comply with ISO9001, ISO13485 and IATF16949 quality‑management requirements to satisfy automotive, medical, industrial and high‑reliability project standards.

Prevent defects via full‑station in‑line inspection: IQC, first‑article confirmation, SPI, AOI, X‑ray and FQC to lower defect rate before shipment.

Ensure complete batch traceability supported by MES production management system.

Continuously improve process capability by equipment upgrade, staff training and process optimization, to reduce rework and improve on‑time delivery performance.

Meet customer specifications with reliable OEM assembly services and prompt technical support.